Texas Instrument, formerly Ciclon Semiconductor, designs and markets Laterally-Diffused Metal Oxide Semiconductor Field Effect Transistor (LD MOSFET) semiconductor devices that are used in wireless applications in computer and telecommunications equipment. The Ben Franklin investment will allow Ciclon to study the mechanical, thermal, and electrical reliability properties of a new low-cost, high-performance power semiconductor package.
This advanced, patent-pending packaging concept has been developed to deliver the industry’s lowest cost, lowest profile, best thermal dissipation, and lowest electrical parasitic elements. Once completed, this packaging platform will be used in concert with Ciclon’s current proprietary silicon technology to feed a growing product demand. These advances will move Ciclon into a leadership position in electronic power packaging.